HEXATHERM XCHiP Chipboard thermal laminate floorboard
by Cellecta
HEXATHERM XCHiP combines the benefits of HEXATHERM high performance thermal insulation with a P5 moisture resistant, tongue and groove chipboard to produce a high compressive strength, interlocking floor board.
Product Benefits
High compressive strength 250/300kPa
Excellent life-long thermal performance
Very low water absorption insulation
Quick and easy to install
Interlocking, moisture resistant chipboard facing
Specification Details for HEXATHERM XCHiP Chipboard thermal laminate floorboard (Chipboards)
Please note that these product properties are not a replacement for the manufacturer's literature and it is always recommended that Cellecta is consulted before specifying.
Size & Weight
Certifications & Ratings
Technical
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| Compressive Strength 10% Max Deflection: (?) | 300 kPa | |
| Features (?) | Durable , Easy to Install , High compressive strength , Low Water Absorption , Quick and easy to install. , thermal insulation | |
| Thermal Conductivity (?) | 0.034 W/mK | 100% |
Physical Properties
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| Edge Type (?) | Tongue & Groove | |
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